TB62213AFG 2012-5-17 1 toshiba bicd integrated ci rcuit silicon monolithic TB62213AFG bicd constant-current two-phase bi polar stepping motor driver ic the TB62213AFG is a two-phase bipolar stepping motor driver using a pwm chopper. fabricated with the bicd process, the TB62213AFG is rated at 40 v/3.0 a. the on-chip voltage regulator allows contro l of a stepping motor with a single v m power supply. features ? bipolar stepping motor driver ? pwm constant-current drive ? allows two-phase, 1-2-phase and w1-2 phase excitations. ? bicd process: uses dmos fets as output power transistors. ? high voltage and current: 40 v/3.0 a (absolute maximum ratings) ? thermal shutdown (tsd), overcurrent shutdo wn (isd), and power-on resets (pors) do not design your products or systems bas ed on the information on this document. please contact your toshiba sales representative for updated information before designing your products. weight: 0.7g(typ.) hsop28-p-450-0.80
TB62213AFG 2012-5-17 2 block diagram functional blocks/circuits/constants in the block chart etc. may be omit ted or simplified for explanatory purposes. ach pre-driver logic vreg tsd/isd/vrs detect bch pre-driver oscillator vref comparator
TB62213AFG 2012-5-17 3 pin assignment oscm vref_a 1 in_a1 out_a standby rs_a out_a in_b1 phase_a in_a2 phase_b 2 3 4 5 6 7 8 9 10 11 14 12 13 21 15 16 17 18 19 20 22 23 24 25 26 27 28 in_b2 fin(gnd) nc nc gnd gnd vref_b nc vcc vm fin(gnd) nc nc nc rs_b out_b gnd gnd out_b TB62213AFG
TB62213AFG 2012-5-17 4 pin function pin no. pin name function 1 in_a1 a-phase excitation control input 2 in_a2 a-phase excitation control input 3 phase_a current direction signal input for a phase 4 phase_b current direction signal input for b phase 5 in_b1 b-phase excitation control input 6 in_b2 b-phase excitation control input 7 by stand output; wait for power saving by disabling oscm 8 rs_a the sink current sensing of a-phase motor coil 9 nc no-connect 10 out_a a-phase positive driver output 11 nc no-connect 12 gnd motor power ground 13 out_a- a-phase negative driver output 14 gnd motor power ground 15 gnd motor power ground 16 out_b- b-phase negative driver output 17 gnd motor power ground 18 nc no-connect 19 out_b b-phase positive driver output 20 nc no-connect 21 rs_b the sink current sensing of b-phase motor coil 22 vm power supply 23 vcc smoothing filter for logic power supply 24 nc no-connect 25 nc no-connect 26 vref_b tunes the current level for b-phase motor drive. 27 vref_a tunes the current level for a-phase motor drive. 28 oscm oscillator pin for pwm choppers
TB62213AFG 2012-5-17 5 absolute maximum ratings (ta = 25c) characteristics symbol rating unit motor power supply v m 40 v motor output voltage v out 40 v motor output current i out 3.0 a logic power supply v cc 6 v digital input voltage v in 6 v v ref reference voltage v ref 5.0 v power dissipation p d 1.3 w operating temperature t opr -20 to 85 c storage temperature t str -55 to 150 c junction temperature t j(max) 150 c operation ranges characteristics symbol test condition min typ. max unit motor power supply v m - 10 24 38 v motor output current i out ta=25c,1corresponding worth - 1.8 2.4 a v in(h) h level of logic 2.0 - 5.5 v digital input voltage v in(l) l level of logic -0.4 - 1.0 v phase signal input frequency f phase - 1.0 - 400 khz chopper frequency f chop - 40 100 150 khz v ref reference voltage v ref - gnd - 3.6 v voltage across the current-sensing resistor pins v rs - 0.0 1.0 1.5 v
TB62213AFG 2012-5-17 6 electrical characteristics (ta = 25c, v m = 24 v, unless otherwise specified) characteristics symbol test condition min typ. max unit v ih 2.0 3.3 5.5 digital input voltage v il digital input pins gnd - 0.8 v supply current im outputs open (two-phase excitation) - 5 7 ma channel-to-channel differential i out1 i out = 2.0a -5 0 5 % output current error relative to the predetermined value i out2 i out = 2.0a -5 0 5 % drain-source on-resistance of the output transistors (upper and lower sum) r on(d-s) i out = 2.0a,tj = 25c 0.4 0.6 0.8 ? power-supply voltage for internal circuit operation v cc i cc =5.0ma 4.75 5.00 5.25 v power-supply current for internal circuit operation i cc - - 2.5 5.0 ma v m recovery voltage v mr - 7.0 8.0 9.0 v overcurrent trip threshold isd - 3.0 4.0 5.0 a operation explanation pin name h l notes in_x outputs enabled outputs disabled when in_x is deasserted low (where a letter x that indicates a phase), its outputs assume the high-impedance state, regardless of the state of that phase. phase_x out_x: h out_x (?): h when phase_x is high, a current normally flows from out_x to out_x (?). standby normal operation mode standby mode when standby is low, both the oscillator and output drivers are disabled. the TB62213AFG can not drive a motor. phase in_1 in_2 output i out (a) l l 0% l h -38% h l -71% l h h -100% l l 0% l h 38% h l 71% h h h 100%
TB62213AFG 2012-5-17 7 package dimensions unit: mm
TB62213AFG 2012-5-17 8 notes on contents block diagrams functional blocks/circuits/constants in the block chart etc. may be omi tted or simplified for explanatory purposes. ic usage considerations notes on handling of ics the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause devi ce breakdown, damage or deteriorat ion, and may result in injury by explosion or combustion. use an appropriate power supply fuse to ensure that a la rge current does not continuo usly flow in the case of overcurrent and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse no ise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. to minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdow n caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protec tion functions. if the po wer supply is unstable, the protection function may not operate, causing ic breakdow n. ic breakdown may cause in jury, smoke or ignition. do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative term inals of power supplies are connected properly. otherwise, the current or power consumption may ex ceed the absolute maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. in addition, do not use any device inse rted in the wrong orientation or incorre ctly to which current is applied even just once. carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. if there is a large amount of leakage current such as from input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input wi thstand voltage, overcurrent or ic failure may cause smoke or igniti on. (the overcurrent may cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection-type ic that inputs output dc voltage to a speaker directly.
TB62213AFG 2012-5-17 9 points to remember when handling of ics overcurrent protection circuit overcurrent protection circuits (referred to as current limiter circuits) do not necessarily protect ics under all circumstances. if the overcurrent protection circuits operate against the overcurrent, clear the overcurrent status immediately. depending on the method of use and usage conditio ns, exceeding absolute maxi mum ratings may cause the overcurrent protection circuit to oper ate improperly or ic breakdown may oc cur before operation. in addition, depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation, the ic may generate heat resulting in breakdown. thermal shutdown circuit thermal shutdown circuits do not necessarily protect ics und er all circumstances. if the thermal shutdown circuits operate against the over-temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal shutdown circuit to operate improperly or ic breakdown to occur before operation. heat radiation design when using an ic with large current flow such as power amp, regulator or driver , design the device so that heat is appropriately radiated, in order not to exceed the specified junction temper ature (tj) at any time or under any condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in a ddition, when designing the device, take into consideration the effect of ic heat radiation with peripheral components. back-emf when a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor?s power supply owing to the effect of back-emf. if the current si nk capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. to avoid this problem, take the effect of bac k-emf into consideration in system design.
TB62213AFG 2012-5-17 10 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nse quential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitat ion, the japanese foreign exchange and foreign trade law and t he u.s. export administration regulations. export and re-export of pr oduct or related software or technology are strictly prohibit ed except in compliance with all appl icable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
|
